Is there anyone out there who could solder some BC847BS in SOT 363 format ( very small ) to a VCA PCB , I have 3 PCBs and maybe 5 more soon , there is one BC847BS per board , I will pay for the service , PCBs and BC847BS supplied by me , at 66 years old my eye sight is not what it used to be . these are the boards .https://www.instructables.com/Band-Pass-Resonant-Filter-and-Amplifier-Module-for/
Apologies if this is obvious, but if you have trouble finding someone, have you tried using a head mounted magnifier? Granted I have not done much SMD, but for what I’ve done, and even for some through hole work, at age 67 I find mine invaluable.
Hey Daryll, just for your information: I am sure the weight of the PCBs will not exceed 500g, so sending it (at least back via German Post - International Letter) is 3.70 EUR:
I just got some SOT-363 breakout boards made and boy howdy those pads are small and close together! Hadn’t really registered how much tinier than e.g. SOIC-8 it is. @tamasgal, @d42kn355, are you doing them with an iron or hot plate or oven or hot air or what? I have a hard time imagining using an iron. (And yes, the footprint is called “SOT-363_SC-70-6_Handsoldering” …)
I prefer solder paste and hot plate and use a microscope. Hot air is a bit dangerous because you can easily blow it away but it’s doable with low flow settings and preheating.
they are incredibly simple to drag solder once you get the hang of it!
I only use hot air for removing things for the most part lol
I just make sure to keep my syringe of flux near by and use minimal solder.
I do not add solder to 1 pin and yada yada like i do with IC’s since they are so tiny.
For me, I like to apply the flux, set the transistor pair (thats what mine usually are) on the pads, hold really lightly with a fine tipped tweezers and drag solder one side and double check the alignment then drag solder the other side!
lol… they’re even more fun to kludge to when you forget a resistor lolol
Yes, I preheat after applying the paste and placing the part(s).
The idea is to raise the temperature of the whole area (to like 175degC) so that it only needs a bit more heat applied locally via hot air to melt the solder. By slowly preheating, the thermal stress on the board is reduced greatly.
Btw. I recommend applying the paste using a scalpel - blade no. 11, that works really nicely for me, for projects where I don’t have a stencil
Yeah, you can get away with hand soldering the SOIC-8s with sufficient care, but I personally lack the steady hand and the gimlet eye required for such undertakings on the 363.
I would publicly like to thank Tamas Gal for soldering the chips on the board , really first class work , right , out with the soldering iron and finish these boards…