Motivated by some self-designed prototyping boards I’ve seen by folks here, @AriaSalvatrice for one, I was inspired to try my hand at designing my own. The following is my first finished beta sketch, and definitely has some issues I still haven’t worked out, but I’m liking where it’s going.
All the colors represent copper traces. Red is +V, green is -V, black is ground. I know it’s backwards but that’s what my brain tells me it should be and I just have to live with that. The orange is intended to be on the back copper layer. The components are mostly just for my reference.
Here are some details:
- It’s two protoboards ganged together, which is probably obvious. One includes a spot for a 10-pin IDC header and other power components, along with dedicated space for an optional 78xx voltage regulator circuit and a small buss for the regulated voltage which can be bridged to one of the middle busses.
- Two dedicated power busses for +/-12V from the eurorack connector. I’m probably going to set this up so that a trace can be bridged or broken in order to make it possible to put +V on both rails. There are two unconnected busses in the center IC “gutter” that can be bridged to ground and/or regulated voltage (or jumped to whatever else) if desired.
- 1+3+4 holes on either side of the gutter all connected by default, which leaves six to work with when there’s an IC in the board, with a thin trace for cutting to 1, 3, 3. I found myself needing just one more hole all too often, so I put in the extras here.
- The single pads on the edges of the boards are for passing signals from board to board via pin headers. Also useful for jumping a signal to another row without “spending” a hole closer to the chip.
- The black squares/rectangles were mostly for my reference while laying this out—they represent space to place pin headers for sending power between stacked boards. I was having trouble finding space on my power busses for headers on my Electrocookie protoboards, so this solves that.
Issues to address:
- I don’t like the inelegant routing of the ground trace in the upper left where it goes from the IDC header under the lead of that PTC fuse to the left ground buss. I’m considering using a ground plane layer just to increase its availability across the board. Alternatively, routing it on the back as well.
- I’m not sure if thin traces designed to be broken are a good idea on a power buss, even if it’s ground.
- I want to be able to use SMD decoupling caps soldered behind the ICs (on the back of the board), so I need to make sure the spacing works for that.
- I’m probably going to run the ground traces on the back of the board, mirroring the front. Same with the “generic” pads.
- I think I want to make use of plated vias in some places for passing signals around back to front (like on the 1 hole pads, and the power connector), but can probably use a bit of wire soldered through on both sides to the same effect, mostly.
- I’m trying to keep the “parts part” of the board to the 2.54mm pitch standard for THT parts, but I’m sure there are places where I don’t actually need to do that.
This ran way longer than I expected, and hopefully it makes sense. I’m totally open to suggestions and feedback. Thanks!